Hong-Ning (Henry) Dai is an associate professor in Faculty of Information Technology at Macau University of Science and Technology. He obtained the Ph.D. degree in Computer Science and Engineering from Department of Computer Science and Engineering at the Chinese University of Hong Kong. He also received the B.Eng. and M.Eng. degrees in Computer Science and Engineering from South China University of Technology. Henry worked in Department of Information Engineering at the Chinese University of Hong Kong and the Hong Kong Applied Science and Technology Research Institute after his Ph.D. study. He also holds visiting positions at Department of Computer Science and Engineering in the Hong Kong University of Science and Technology, School of Electrical Engineering and Telecommunications in the University of New South Wales, Hong Kong Applied Science and Technology Research Institute, School of Data and Computer Science in Sun Yat-sen University (Guangzhou, China), School of Computer Science and Engineering in University of Electronic Science and Technology of China, School of Mechanical and Automotive Engineering in South China University of Technology, respectively.
His research interests include cyber-physical systems, wireless networks, and big data analytics. He has published more than 80 peer-reviewed papers in refereed conferences and journals, including IEEE Transactions on Industrial Informatics, IEEE Transactions on Vehicular Technology, ACM/Springer Wireless Networks, IEEE INFOCOM, IEEE ICC, IEEE GLOBECOM, IEEE WCNC, IEEE PIMRC, ACM WUWNet, IEEE LCN, IEEE WoWMoM, IEEE ICCS, IEEE ISSNIP, ICCS etc. He has served as a guest editor of IEEE Transactions on Industrial Informatics, editorial board members in International Journal of Industrial Engineering Computations, International Journal of Wireless and Mobile Communication for Industrial Systems and International Journal of Data and Network Science. He also served as conference staff members to co-organize a number of conferences, including IEEE ICCS, ACM MobiHoc, IEEE ANT, IEEE SCC, IEEE GCC and CIAPR etc. He is a senior member of the Institute of Electrical and Electronics Engineers (IEEE) and a professional member of the Association for Computing Machinery (ACM). He is a winner of BOC Excellent Research Award of Macau University of Science and Technology. He is also the holder of 1 U.S. patent and 1 Australia innovation patent. His Ërdos Number is 5.