Hong-Ning Dai is an associate professor in Faculty of Information Technology at Macau University of Science and Technology. He obtained the Ph.D. degree in Computer Science and Engineering from Department of Computer Science and Engineering at the Chinese University of Hong Kong. He worked in Department of Information Engineering at the Chinese University of Hong Kong and the Hong Kong Applied Science and Technology Research Institute after his Ph.D. study. He also holds visiting positions at Department of Computer Science and Engineering in the Hong Kong University of Science and Technology, School of Electrical Engineering and Telecommunications in the University of New South Wales, Hong Kong Applied Science and Technology Research Institute, School of Data and Computer Science in Sun Yat-sen University (Guangzhou, China), School of Computer Science and Engineering in University of Electronic Science and Technology of China, School of Mechanical and Automotive Engineering in South China University of Technology, respectively.
His research interests include Internet of Things, Big Data Analytics and Blockchains. He has published more than 100 peer-reviewed papers in top-tier journals and conferences, including ACM Computing Surveys, IEEE Transactions on Industrial Informatics, IEEE Internet of Things Journal, IEEE Transactions on Vehicular Technology, ACM Transactions on Intelligent Systems and Technology, IEEE Transactions on Intelligent Transportation Systems, IEEE Transactions on Computational Social Systems, ACM/Springer Wireless Networks, IEEE INFOCOM, IEEE ICC, IEEE GLOBECOM, IEEE WCNC, IEEE PIMRC, ACM WUWNet, IEEE LCN, etc. He has 3 ESI highly-cited papers awarded by Clarivate Analytics and 1 IEEE Outstanding Paper Award conferred by IEEE CPSCom 2019. He is also the holder of 1 U.S. patent and 1 Australia innovation patent. Due to his outstanding research performance, he was awarded with BOC Excellent Research Award of Macau University of Science and Technology in 2015.
Hong-Ning has been actively involved with a number of professional activities. In particular, he has served as guest editors of IEEE Transactions on Industrial Informatics for special sections on “Blockchain for Industrial Internet of Things“, “Emerging Privacy and Security Issues brought by Artificial Intelligence“, and “Blockchain Solutions for Industrial Internet of Things” in 2018, 2019, 2020, respectively and IEEE Transactions on Emerging Topics in Computing for special section on “Scalable Computing for Blockchain Systems“. Meanwhile, he is also serving as Associate Editors in IEEE Access, Ad Hoc Networks (Elsevier), Connection Science (Taylor & Francis) and International Journal of Cognitive Computing in Engineering (Elsevier), Technical Committee of Computer Communications (Elsevier) and topic editor of Sensors. He has also served as TPC chairs of 2019 International Conference on Blockchain and Trustworthy Systems (BlockSys’ 2019), 2020 International Conference on Blockchain and Trustworthy Systems (BlockSys’ 2020). TPC co-chair of special session on “Blockchain technology in industry” in conjunction with 2020 IEEE 16th International Conference on Automation Science and Engineering (CASE), TPC co-chair of special session on “Blockchain for Industrial Internet-of-Things” in conjunction with IEEE International Conference on Industrial Cyber-Physical Systems 2019, TPC co-chair of special session on “Recent Advances in Security and Privacy in Wireless Networking Systems” in conjunction with the 10th International Conference on Information, Communications and Signal Processing, 2015. He has been reviewers for more than 40 journals including IEEE Internet of Things Journal, IEEE Network, IEEE Transactions on Knowledge and Data Engineering, IEEE Communications Magazine, IEEE Transactions on Cloud Computing, ACM Trans. on Sensor Networks, ACM Transactions on Intelligent Systems and Technology, IEEE Transactions on Wireless Communications, etc. He is also a Founding Member of of the IEEE Special Interest Groups (SIG) on Intelligent Internet Edge (IIE) at IEEE. He is a senior member of the Institute of Electrical and Electronics Engineers (IEEE) and a professional member of the Association for Computing Machinery (ACM).
